Powering UK Industry
Through Legacy
Packaging
Establishing structured OSAT capability in Wales to support long-term automotive and industrial semiconductor demand.
JPS Technologies Ltd is focused on establishing advanced legacy semiconductor packaging infrastructure in the United Kingdom, supported by international operational expertise. The company’s objective is to enhance regional capability and contribute to supply chain stability for critical industries.

OUR COMMITMENT
Delivering structured, high-reliability OSAT operations aligned with industrial demand.

OUR DIRECTION
Strengthening domestic semiconductor packaging capability for the long term.
Legacy Packaging Expertise
Legacy semiconductors demand long lifecycle stability and supply reliability. The facility will specialize in mature-node packaging for:
- Automotive electronics
Reliable packaging for long-life vehicle systems.
- Industrial systems
Robust solutions for mission-critical industrial applications.
- Energy and mobility infrastructure
Stable packaging for power and electrification networks.
Facility Overview
01 /04
A strategic step toward reinforcing domestic semiconductor capability. The Wales OSAT / ATMP facility will

Deliver assembly, testing, marking, and packaging services

Support automotive and industrial semiconductor demand

Introduce scalable operational processes

Contribute to regional semiconductor manufacturing infrastructure
Strategic
Collaboration
Supported by RRP Electronics, a pioneer in legacy OSAT operations in India, the initiative strengthens execution readiness for the Wales facility.
Why JPS Technologies
JPS brings together strategic intent and proven operational alignment to strengthen legacy semiconductor packaging capability within the United Kingdom.



Focused expertise in legacy semiconductor packaging
Structured international collaboration
Scalable OSAT / ATMP deployment model
Alignment with UK industrial and supply chain priorities
Building the Future Platform
Building the Future Platform
Building the Future Platform
Building the Future Platform
Building the Future Platform
Building the Future Platform
Building the Future Platform
Building the Future Platform

Establishing facility design, site readiness, and technical infrastructure to support ATMP operations.

Implementing structured assembly, testing, marking, and packaging frameworks aligned with global standards.

Strengthening partnerships across automotive, industrial, and semiconductor ecosystem stakeholders.

Progressively scaling operational capacity to ensure stable and disciplined market entry.
JPS Technologies is advancing the Wales facility as a scalable legacy semiconductor packaging platform for the United Kingdom.
- Infrastructure Development
- Operational System Deployment
- Strategic Industry Engagement
- Phased Production Ramp-Up
News & Events

NEWS
JPS Technologies Signs MoU to Establish OSAT Facility in Wales
Strengthening the UK’s semiconductor capability with proven expertise and automotive-grade reliability.
January, 2026
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