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Powering UK Industry
Through Legacy
Packaging

Establishing structured OSAT capability in Wales to support long-term automotive and industrial semiconductor demand.

JPS Technologies Ltd is focused on establishing advanced legacy semiconductor packaging infrastructure in the United Kingdom, supported by international operational expertise. The company’s objective is to enhance regional capability and contribute to supply chain stability for critical industries.

Our Commitment

OUR COMMITMENT

Delivering structured, high-reliability OSAT operations aligned with industrial demand.

Our Direction

OUR DIRECTION

Strengthening domestic semiconductor packaging capability for the long term.

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Legacy Packaging Expertise

Legacy semiconductors demand long lifecycle stability and supply reliability. The facility will specialize in mature-node packaging for:

  • Automotive electronics

    Reliable packaging for long-life vehicle systems.

  • Industrial systems

    Robust solutions for mission-critical industrial applications.

  • Energy and mobility infrastructure

    Stable packaging for power and electrification networks.

Facility Decoration

Facility Overview

01 /04

A strategic step toward reinforcing domestic semiconductor capability. The Wales OSAT / ATMP facility will

Facility Overview

Deliver assembly, testing, marking, and packaging services

Facility Overview

Support automotive and industrial semiconductor demand

Facility Overview

Introduce scalable operational processes

Facility Overview

Contribute to regional semiconductor manufacturing infrastructure

Strategic
Collaboration

Supported by RRP Electronics, a pioneer in legacy OSAT operations in India, the initiative strengthens execution readiness for the Wales facility.

Proven legacy packaging expertise

Proven legacy packaging expertise

Established operational frameworks

Established operational frameworks

Structured knowledge transfer

Structured knowledge transfer

Advanced manufacturing practices

Advanced manufacturing practices

Why JPS Technologies

JPS brings together strategic intent and proven operational alignment to strengthen legacy semiconductor packaging capability within the United Kingdom.

Why JPS

Focused expertise in legacy semiconductor packaging

Structured international collaboration

Scalable OSAT / ATMP deployment model

Alignment with UK industrial and supply chain priorities

Building the Future Platform

Building the Future Platform

Building the Future Platform

Building the Future Platform

Building the Future Platform

Building the Future Platform

Building the Future Platform

Building the Future Platform

Infrastructure Development

Establishing facility design, site readiness, and technical infrastructure to support ATMP operations.

Operational System Deployment

Implementing structured assembly, testing, marking, and packaging frameworks aligned with global standards.

Strategic Industry Engagement

Strengthening partnerships across automotive, industrial, and semiconductor ecosystem stakeholders.

Phased Production Ramp-Up

Progressively scaling operational capacity to ensure stable and disciplined market entry.

JPS Technologies is advancing the Wales facility as a scalable legacy semiconductor packaging platform for the United Kingdom.

  • Infrastructure Development
  • Operational System Deployment
  • Strategic Industry Engagement
  • Phased Production Ramp-Up

News & Events

RRP JPS MoU

NEWS

JPS Technologies Signs MoU to Establish OSAT Facility in Wales

Strengthening the UK’s semiconductor capability with proven expertise and automotive-grade reliability.

January, 2026

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